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290mm*20M 0.1mm Thick, Heat Withstand, Double Face Adhered Tape, Polyimide Film for SMT, BGA

Home » Office & School Supplies » Tapes, Adhesives & Fasteners » 290mm*20M 0.1mm Thick, Heat Withstand, Double Face Adhered Tape, Polyimide Film for SMT, BGA
Enlarge 290mm*20M 0.1mm Thick, Heat Withstand, Double Face Adhered Tape, Polyimide Film for SMT, BGA
290mm*20M 0.1mm Thick, Heat Withstand, Double Face Adhered Tape, Polyimide Film for SMT, BGA enlarge
290mm*20M 0.1mm Thick, Heat Withstand, Double Face Adhered Tape, Polyimide Film for SMT, BGA enlarge
Price from: 225.23 $
Prices are approximate and are indebted to the time of inclusion in the product catalog.

Description:

290mm*20M 0.1mm Thick, Heat Withstand, Double Face Adhered Tape, Polyimide Film for SMT, BGA
Introducing our high-quality 290mm*20M 0.1mm Thick Double Face Adhered Tape, specifically designed for Surface Mount Technology (SMT) and Ball Grid Array (BGA) applications. This tape is made from polyimide film, which provides excellent heat resistance and durability, making it an ideal choice for demanding industrial environments.

With a width of 290mm and a length of 20 meters, this double face adhered tape offers ample coverage for your SMT and BGA needs. The 0.1mm thickness ensures precise and secure bonding, allowing for seamless assembly and reliable performance. Whether you are working on electronic components, circuit boards, or other delicate applications, this tape provides the perfect solution for your adhesive requirements.

The heat withstand capability of this tape is exceptional, making it suitable for use in high-temperature environments. Its polyimide film construction ensures that it can withstand extreme heat without compromising its adhesive properties. This feature makes it an excellent choice for applications that involve soldering, reflow, or wave soldering processes, providing reliable adherence even under challenging conditions.

In summary, our 290mm*20M 0.1mm Thick Double Face Adhered Tape offers a reliable and durable solution for SMT and BGA applications. Its polyimide film construction ensures excellent heat resistance, while the double face adhesive provides secure bonding. With its generous dimensions and exceptional heat withstand capability, this tape is a versatile and reliable choice for various

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